PN Type Package Designator Pb-Free Packages - Manufacturing Conversion Datecode, Refer to Note 1 Type of Plating / Finish Matte Tin Annealing Process Minimum Plating Thickness Does this Microchip Pb-free device meet RoHS compliance for the following 6 materials: Pb, Hg, Cr6+, Cd, and PBB / PBDE Total Mass (g) STANDARD8L MSOP 3x3mm0502Matte Tin150C / 1hr w/l 24 hours400 microinchesYes0.0256
MCP3301T-CI/MS |
RFQ for MCP3301T-CI/MS |
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| Technical/Catalog Information | MCP3301T-CI/MS |
| Vendor | Microchip Technology |
| Category | Integrated Circuits (ICs) |
| Number of Bits | 13 |
| Package / Case | 8-MSOP, Micro8?, 8-uMAX, 8-uSOP, |
| Data Interface | Serial |
| Packaging | Tape & Reel (TR) |
| Sampling Rate (Per Second) | 100k |
| Operating Temperature | -40°C ~ 85°C |
| Voltage Supply Source | Single |
| Number of Inputs and Type | 1 Differential, Bipolar; 1 Pseudo-Differential, Bipolar |
| Number of Converters | 1 |
| Power Dissipation (Max) | - |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | MCP3301T CI MS MCP3301TCIMS |
| Product | Manufacturers | Pack | D/C | ||||||||
| MCP3301T-CI/MS | - | - | - |